Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Dettagli Bibliografici
Autore principale:	Chen, Chih.
Altri autori:	Tong, H.M., Tu K.N.
Natura:	Articolo
Lingua:	English
Soggetti:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
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Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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