Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Bibliografische gegevens
Hoofdauteur:	Chen, Chih.
Andere auteurs:	Tong, H.M., Tu K.N.
Formaat:	Artikel
Taal:	English
Onderwerpen:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Tags:	Voeg label toe Geen labels, Wees de eerste die dit record labelt!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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