Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Opis bibliograficzny
1. autor:	Chen, Chih.
Kolejni autorzy:	Tong, H.M., Tu K.N.
Format:	Artykuł
Język:	English
Hasła przedmiotowe:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Etykiety:	Dodaj etykietę Nie ma etykietki, Dołącz pierwszą etykiete!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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