Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Библиографические подробности
Главный автор:	Chen, Chih.
Другие авторы:	Tong, H.M., Tu K.N.
Формат:	Статья
Язык:	English
Предметы:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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