Electromigration and thermomigration in pb-free flip-chip solder joints /

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Electromigration and thermomigration in pb-free flip-chip solder joints /

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Bibliografiska uppgifter
Huvudupphovsman:	Chen, Chih.
Övriga upphovsmän:	Tong, H.M., Tu K.N.
Materialtyp:	Artikel
Språk:	English
Ämnen:	Current stressing Diffusion Joule heating Microelectronic packaging Reliability Thermal gradient Underbump metallizaiton
Taggar:	Lägg till en tagg Inga taggar, Lägg till första taggen!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

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