48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education
保存先:
| フォーマット: | 図書 |
|---|---|
| 言語: | Undetermined |
| 出版事項: |
Washington
EIA
1998
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| 主題: | |
| タグ: |
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| Thư viện lưu trữ: | Trung tâm Học liệu Trường Đại học Cần Thơ |
|---|
| LEADER | 00644nam a2200181Ia 4500 | ||
|---|---|---|---|
| 001 | CTU_122361 | ||
| 008 | 210402s9999 xx 000 0 und d | ||
| 082 | |a 621.381 | ||
| 082 | |b F773 | ||
| 245 | 0 | |a 48th electronic components & technology conference: | |
| 245 | 0 | |b Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education | |
| 245 | 0 | |c IEEE | |
| 260 | |a Washington | ||
| 260 | |b EIA | ||
| 260 | |c 1998 | ||
| 650 | |a Electronic apparatus and appliances.,Microelectronics | ||
| 904 | |i M.Loan | ||
| 980 | |a Trung tâm Học liệu Trường Đại học Cần Thơ | ||