48th electronic components & technology conference:

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48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education

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Dades bibliogràfiques
Format:	Llibre
Idioma:	Undetermined
Publicat:	Washington EIA 1998
Matèries:	Electronic apparatus and appliances.,Microelectronics
Etiquetes:	Afegir etiqueta Sense etiquetes, Sigues el primer a etiquetar aquest registre!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

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