48th electronic components & technology conference: Interconnections packing Modeling & Simulation; Material & Processess reliability components manufacturring technology electronic packing education

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Fformat: Llyfr
Iaith:Undetermined
Cyhoeddwyd: Washington EIA 1998
Pynciau:
Tagiau: Ychwanegu Tag
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
Thư viện lưu trữ: Trung tâm Học liệu Trường Đại học Cần Thơ