Porous pSiCOH ultralow-k dielectrics for chip interconnects prepared by PECVD /

QR Code

Porous pSiCOH ultralow-k dielectrics for chip interconnects prepared by PECVD /

Enregistré dans:

Détails bibliographiques
Auteur principal:	Grill, Alfred.
Format:	Article
Langue:	English
Sujets:	Interconnects PECVD PSICOH dielectric Ultralow-k dielectrics
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

Thư viện lưu trữ:	Thư viện Trường Đại học Đà Lạt

Documents similaires

Dependence of ozone generation in a micro dielectric barrier discharge on dielectric material and micro gap length /
par: Sakoda, Tatsuya.

Device physics and design of hetero-gate dielectric tunnel field-effect transistors with different low/high-k EOT ratios
par: Chun-Hsing Shih, et autres
Publié: (2024)

Application of dielectric spectroscopy measurements for estimating moisture content in power transformers /
par: Ekanayake, Chandima.

Different roles and designs of hetero-gate dielectric in single- and double-gate tunnel field-effect transistors
par: Nguyễn, Đăng Chiến, et autres
Publié: (2023)

Preventing biomolecular adsorption in electrowetting-based biofluidic chips /
par: Yoon, Jeong-Yeol.

Dùng phần mềm Matlab tính hệ số phản xạ của màng điện môi đa lớp :
par: Khổng, Như Phương
Publié: (2013)

Matrix effects affecting the indirect calibration of the static headspace-gas chromatographic method used for dissolved gas analysis in dielectric liquids /

Semiconductor-thickness-dependent design of hetero-gate dielectric in double-gate TFETs
par: Nguyễn, Đăng Chiến, et autres
Publié: (2024)

Influence of hetero-gate dielectrics on short-channel effects in scaled tunnel field-effect transistors
par: Nguyễn, Đăng Chiến, et autres
Publié: (2024)

Thin-film organic electronic devices /
par: Katz, Howard E.

Insulating materials for optoelectronics : new developments /
Publié: (1995)

Insulating materials for optoelectronics : new developments /
Publié: (1995)

Dielectric barrier discharge for ultraviolet light generation and its efficient driving inverter circuit /
par: Oleg, Kudryavtsev.

Effects of Insulator Dielectric Passivation Layer on the Breakdown Voltage of AlGaN/GaN High Electron Mobility Transistor
par: Than, Hong Phuc, et autres
Publié: (2022)

Physical properties of composites near percolation /
par: Nan, C.-W.

Application of molecular beam deflection time-of-flight mass spectrometry to peptide analysis /

The Electric Theories of J. Clerk Maxwell: A Historical and Critical Study
par: Duhem, Pierre Maurice Marie
Publié: (2016)

Low Power Interconnect Design
par: Saini, Sandeep
Publié: (2015)

Robust interconnects and packaging for microfluidic elastomeric chips /

Fabrication and characterization of masterbatches made from poly(vinyl chloride) and modified fly ash /
par: Do Quang Tham.

Compact Models and Performance Investigations for Subthreshold Interconnects
par: Dhiman, Rohit, et autres
Publié: (2015)

Multi-Net Optimization of VLSI Interconnect
par: Moiseev, Konstantin, et autres
Publié: (2015)

On the topological properties of grid-based interconnection networks : Surface area and volume of radial spheres /
par: Sarbazi-Azad, H.

Intra-molecular donor-acceptor interaction effects on charge dissociation, charge transport, and charge collection in bulk-heterojunction organic solar cells /

Surface plasmon resonance spectroscopy based on evanescent field treatment /
par: Ekgasit, Sanong.

Transverse scaling of Schottky barrier charge-trapping cells for energy-efficient applications
par: Hung-Jin Teng, et autres
Publié: (2021)

Size-dependent resistivity in nanoscale interconnects /
par: Josell, Daniel.

The edge-fault-tolerant bipancyclicity of the even K-ary N-cube /
par: Fang Jywe-Fei,.

PSCAD/EMTDC modeling/analysis of VSC-HVDC transmission for cross border power system interconnection /
par: Kim, Jong-Yul.

Template-free synthesis of interconnected hollow carbon nanospheres for high-performance anode material in lithium-ion batteries /

Economic feasibility on the interconnected electric power systems in North-East Asia /
par: Chung, Koo-Hyung.

Improved AlGaN/GaN HEMT Performance by Using Field Plate and Passivation Layer
par: Than, Hong Phuc, et autres
Publié: (2022)

Multistage interconnection networks
par: Gunawan, Indra

The bipancycle-connectivity and the m-pancycle-connectivity of the K-ary N-cube /
par: Fang, Jywe-Fei.

Gateable nanofluidic interconnects for multilayered microfluidic separation systems/

Một số vấn đề qui hoạch và thiết kế mạng điện địa phương
par: Ngô Hồng Quang
Publié: (1970)

On-chip communication architectures : system on chip interconnect
par: Pasricha, Sudeep
Publié: (2008)

On-Chip Communication Architectures (System on Chip Interconnect)
par: Sudeep, Pasricha, et autres
Publié: (2026)

Insulating materials for optoelectronics
Publié: (1995)

Ceramic interconnect technology handbook
Publié: (2007)