The science and engineering of microelectronic fabrication

Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture...

詳細記述

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書誌詳細
第一著者: Stephen A. Campbell
その他の著者: Stephen A. Campbell.
言語:Undetermined
English
出版事項: New York Oxford University Press 2001
主題:
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Thư viện lưu trữ: Trung tâm Học liệu Trường Đại học Trà Vinh
その他の書誌記述
要約:Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of current state-of-the-art devices. Each chapter includes sample problems with solutions
物理的記述:xiv, 603 p.
ill.
24 cm
ISBN:0195136055
978-0195136050