The science and engineering of microelectronic fabrication

Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture...

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Auteur principal: Stephen A. Campbell
Autres auteurs: Stephen A. Campbell.
Langue:Undetermined
English
Publié: New York Oxford University Press 2001
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Thư viện lưu trữ: Trung tâm Học liệu Trường Đại học Trà Vinh
Description
Résumé:Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of current state-of-the-art devices. Each chapter includes sample problems with solutions
Description matérielle:xiv, 603 p.
ill.
24 cm
ISBN:0195136055
978-0195136050