The science and engineering of microelectronic fabrication

Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture...

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Bibliographic Details
Main Author: Stephen A. Campbell
Other Authors: Stephen A. Campbell.
Language:Undetermined
English
Published: New York Oxford University Press 2001
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Institutions: Trung tâm Học liệu Trường Đại học Trà Vinh
Description
Summary:Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of current state-of-the-art devices. Each chapter includes sample problems with solutions
Physical Description:xiv, 603 p.
ill.
24 cm
ISBN:0195136055
978-0195136050