The science and engineering of microelectronic fabrication
Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture...
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| Tác giả chính: | |
|---|---|
| Tác giả khác: | |
| Ngôn ngữ: | Undetermined English |
| Được phát hành: |
New York
Oxford University Press
2001
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| Những chủ đề: | |
| Các nhãn: |
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| Thư viện lưu trữ: | Trung tâm Học liệu Trường Đại học Trà Vinh |
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| LEADER | 01338nam a2200265Ia 4500 | ||
|---|---|---|---|
| 001 | TVU_12654 | ||
| 008 | 210423s9999 xx 000 0 und d | ||
| 020 | |a 0195136055 | ||
| 020 | |a 978-0195136050 | ||
| 041 | |a eng | ||
| 082 | |a 621.38152 | ||
| 082 | |b ST206 | ||
| 100 | |a Stephen A. Campbell | ||
| 245 | 4 | |a The science and engineering of microelectronic fabrication | |
| 245 | 0 | |c Stephen A. Campbell. | |
| 260 | |a New York | ||
| 260 | |b Oxford University Press | ||
| 260 | |c 2001 | ||
| 300 | |a xiv, 603 p. | ||
| 300 | |b ill. | ||
| 300 | |c 24 cm | ||
| 520 | |a Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of current state-of-the-art devices. Each chapter includes sample problems with solutions | ||
| 650 | |a Semiconductors --Design and construction | ||
| 700 | |a Stephen A. Campbell. | ||
| 980 | |a Trung tâm Học liệu Trường Đại học Trà Vinh | ||