Materials for high-density electronic packaging and interconnection

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Materials for high-density electronic packaging and interconnection

Wedi'i Gadw mewn:

Manylion Llyfryddiaeth
Fformat:	Llyfr
Iaith:	Undetermined
Cyhoeddwyd:	New York National Academy Press 1990
Pynciau:	Electronic packaging Materials
Tagiau:	Ychwanegu Tag Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

Eitemau Tebyg

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Cyhoeddwyd: (1999)

4th electronics packaging technology conference (EPTC 2002)
Cyhoeddwyd: (2002)

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Cyhoeddwyd: (1997)

Proceedings of the 1997 1st Electronic Packaging Technology Conference
gan: Tay, Andrew A.O
Cyhoeddwyd: (1997)

Microelectronic packaging
gan: Datta, M.
Cyhoeddwyd: (2005)

Advanced electronic packaging
Cyhoeddwyd: (2006)

Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
gan: Qu, Shichun, et al.
Cyhoeddwyd: (2015)

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
gan: Suhir, Ephraim, et al.
Cyhoeddwyd: (2020)

Food packaging science and technology
gan: Lee, Dong Sun
Cyhoeddwyd: (2008)

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gan: Kwok, H. L.
Cyhoeddwyd: (1997)

Intelligent and active packaging for fruits and vegetables
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Cyhoeddwyd: (2007)

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Food packaging technology.
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Cyhoeddwyd: (2015)

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Cyhoeddwyd: (2003)

MEMS/MOEMS packaging : concepts, designs, materials, and processes /
gan: Gilleo, Ken.
Cyhoeddwyd: (2005)

Materials for Advanced Packaging
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Cyhoeddwyd: (2020)

Ceramic interconnect technology handbook
Cyhoeddwyd: (2007)

Integrated Circuit Packaging, Assembly and Interconnections
gan: Greig, William
Cyhoeddwyd: (2020)

Packaging design :
gan: Klimchuk, Marianne Rosner
Cyhoeddwyd: (2012)

Ceramic materials for electronics
Cyhoeddwyd: (2004)

Electronic basis of the strength of materials
gan: Gilman, John J.
Cyhoeddwyd: (2003)

Toxicants in food packaging and household plastics
gan: Snedeker, Suzanne M
Cyhoeddwyd: (2014)

Modified atmospheric processing and packaging of fish :
Cyhoeddwyd: (2006)

Copper Interconnect Technology
gan: Gupta, Tapan
Cyhoeddwyd: (2020)

Developing and Promoting a Community-Based Package Tour in Northern Vietnam at Vntour Joint Stock Company
gan: Cung, Thi Thanh Thuy
Cyhoeddwyd: (2025)

Springer Handbook of Electronic and Photonic Materials
gan: Kasap, Safa, et al.
Cyhoeddwyd: (2020)

Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques (Mcgraw-Hill Nanoscience and Technology Series /
gan: Tomm Jens W
Cyhoeddwyd: (2006)

Developing and Promoting a Golf tour Package at OmegaTours Company Limited
gan: Dinh, Nhat Bao Nhu
Cyhoeddwyd: (2025)

Food packaging science and technology
gan: Lee, Dong Sun
Cyhoeddwyd: (2008)

Food packaging and shelf life :
Cyhoeddwyd: (2009)

The packaging designer's book of patterns
gan: Wybenga, George L.
Cyhoeddwyd: (2006)

The packaging designer's book of patterns
gan: Wybenga, George L.
Cyhoeddwyd: (2006)

Developing and Promoting an Ecotourism Package Tour in the Mekong Delta at Vntour Joint Stock Travel Company
gan: Tran, Thuy Tien
Cyhoeddwyd: (2025)

Developing and Promoting a Leisure Package tour in Ninh Thuan - Binh Thuan at Sun Travel Co.ltd
gan: Le, Huynh Ngoc Huyen
Cyhoeddwyd: (2025)

Food packaging :
gan: Robertson, Gordon L.
Cyhoeddwyd: (2006)

Springer Handbook of Electronic and Photonic Materials. 2nd ed. 2017
gan: Kasap, Safa, et al.
Cyhoeddwyd: (2020)