Materials for high-density electronic packaging and interconnection

Mã QR

Materials for high-density electronic packaging and interconnection

Đã lưu trong:

书目详细资料
格式:	图书
语言:	Undetermined
出版:	New York National Academy Press 1990
主题:	Electronic packaging Materials
标签:	添加标签没有标签, 成为第一个标记此记录!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

相似书籍

Plastic packaging materials for food : barrier function, mass transport, quality assurance, and legislation /
出版: (1999)

4th electronics packaging technology conference (EPTC 2002)
出版: (2002)

The Wiley encyclopedia of packaging technology.
出版: (1997)

Proceedings of the 1997 1st Electronic Packaging Technology Conference
由: Tay, Andrew A.O
出版: (1997)

Microelectronic packaging
由: Datta, M.
出版: (2005)

Advanced electronic packaging
出版: (2006)

Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
由: Qu, Shichun, et al.
出版: (2015)

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
由: Suhir, Ephraim, et al.
出版: (2020)

Food packaging science and technology
由: Lee, Dong Sun
出版: (2008)

Electronic materials /
由: Kwok, H. L.
出版: (1997)

Intelligent and active packaging for fruits and vegetables
由: Wilson, Charles L.
出版: (2007)

Modern packaging encyclopedia
出版: (1968)

Food packaging technology.
出版: (1996)

Food packaging technology.
出版: (1996)

Modern packaging encyclopedia 1970
出版: (1970)

Electronic materials : inside electronic devices.
出版: (1998)

The Automatic Packaging Machinery Sector in Italy and Germany
由: Fortis, Marco, et al.
出版: (2015)

Electronic materials and processes handbook
由: Harper, Charles A.
出版: (2003)

MEMS/MOEMS packaging : concepts, designs, materials, and processes /
由: Gilleo, Ken.
出版: (2005)

Ceramic interconnect technology handbook
出版: (2007)

Materials for Advanced Packaging
由: Lu, Daniel, et al.
出版: (2020)

Integrated Circuit Packaging, Assembly and Interconnections
由: Greig, William
出版: (2020)

Packaging design :
由: Klimchuk, Marianne Rosner
出版: (2012)

Ceramic materials for electronics
出版: (2004)

Electronic basis of the strength of materials
由: Gilman, John J.
出版: (2003)

Toxicants in food packaging and household plastics
由: Snedeker, Suzanne M
出版: (2014)

Copper Interconnect Technology
由: Gupta, Tapan
出版: (2020)

Modified atmospheric processing and packaging of fish :
出版: (2006)

Developing and Promoting a Community-Based Package Tour in Northern Vietnam at Vntour Joint Stock Company
由: Cung, Thi Thanh Thuy
出版: (2025)

Springer Handbook of Electronic and Photonic Materials
由: Kasap, Safa, et al.
出版: (2020)

Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques (Mcgraw-Hill Nanoscience and Technology Series /
由: Tomm Jens W
出版: (2006)

Developing and Promoting a Golf tour Package at OmegaTours Company Limited
由: Dinh, Nhat Bao Nhu
出版: (2025)

Food packaging science and technology
由: Lee, Dong Sun
出版: (2008)

Food packaging and shelf life :
出版: (2009)

The packaging designer's book of patterns
由: Wybenga, George L.
出版: (2006)

The packaging designer's book of patterns
由: Wybenga, George L.
出版: (2006)

Developing and Promoting an Ecotourism Package Tour in the Mekong Delta at Vntour Joint Stock Travel Company
由: Tran, Thuy Tien
出版: (2025)

Developing and Promoting a Leisure Package tour in Ninh Thuan - Binh Thuan at Sun Travel Co.ltd
由: Le, Huynh Ngoc Huyen
出版: (2025)

Food packaging :
由: Robertson, Gordon L.
出版: (2006)

Springer Handbook of Electronic and Photonic Materials. 2nd ed. 2017
由: Kasap, Safa, et al.
出版: (2020)