Materials for high-density electronic packaging and interconnection

QRコード

Materials for high-density electronic packaging and interconnection

保存先:

書誌詳細
フォーマット:	図書
言語:	Undetermined
出版事項:	New York National Academy Press 1990
主題:	Electronic packaging Materials
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

Thư viện lưu trữ:	Trung tâm Học liệu Trường Đại học Cần Thơ

類似資料

Plastic packaging materials for food : barrier function, mass transport, quality assurance, and legislation /
出版事項: (1999)

4th electronics packaging technology conference (EPTC 2002)
出版事項: (2002)

The Wiley encyclopedia of packaging technology.
出版事項: (1997)

Proceedings of the 1997 1st Electronic Packaging Technology Conference
著者:: Tay, Andrew A.O
出版事項: (1997)

Microelectronic packaging
著者:: Datta, M.
出版事項: (2005)

Advanced electronic packaging
出版事項: (2006)

Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
著者:: Qu, Shichun, 等
出版事項: (2015)

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
著者:: Suhir, Ephraim, 等
出版事項: (2020)

Food packaging science and technology
著者:: Lee, Dong Sun
出版事項: (2008)

Electronic materials /
著者:: Kwok, H. L.
出版事項: (1997)

Intelligent and active packaging for fruits and vegetables
著者:: Wilson, Charles L.
出版事項: (2007)

Modern packaging encyclopedia
出版事項: (1968)

Food packaging technology.
出版事項: (1996)

Food packaging technology.
出版事項: (1996)

Modern packaging encyclopedia 1970
出版事項: (1970)

Electronic materials : inside electronic devices.
出版事項: (1998)

The Automatic Packaging Machinery Sector in Italy and Germany
著者:: Fortis, Marco, 等
出版事項: (2015)

Electronic materials and processes handbook
著者:: Harper, Charles A.
出版事項: (2003)

MEMS/MOEMS packaging : concepts, designs, materials, and processes /
著者:: Gilleo, Ken.
出版事項: (2005)

Materials for Advanced Packaging
著者:: Lu, Daniel, 等
出版事項: (2020)

Ceramic interconnect technology handbook
出版事項: (2007)

Integrated Circuit Packaging, Assembly and Interconnections
著者:: Greig, William
出版事項: (2020)

Packaging design :
著者:: Klimchuk, Marianne Rosner
出版事項: (2012)

Ceramic materials for electronics
出版事項: (2004)

Electronic basis of the strength of materials
著者:: Gilman, John J.
出版事項: (2003)

Toxicants in food packaging and household plastics
著者:: Snedeker, Suzanne M
出版事項: (2014)

Modified atmospheric processing and packaging of fish :
出版事項: (2006)

Copper Interconnect Technology
著者:: Gupta, Tapan
出版事項: (2020)

Developing and Promoting a Community-Based Package Tour in Northern Vietnam at Vntour Joint Stock Company
著者:: Cung, Thi Thanh Thuy
出版事項: (2025)

Springer Handbook of Electronic and Photonic Materials
著者:: Kasap, Safa, 等
出版事項: (2020)

Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques (Mcgraw-Hill Nanoscience and Technology Series /
著者:: Tomm Jens W
出版事項: (2006)

Developing and Promoting a Golf tour Package at OmegaTours Company Limited
著者:: Dinh, Nhat Bao Nhu
出版事項: (2025)

Food packaging science and technology
著者:: Lee, Dong Sun
出版事項: (2008)

Food packaging and shelf life :
出版事項: (2009)

The packaging designer's book of patterns
著者:: Wybenga, George L.
出版事項: (2006)

The packaging designer's book of patterns
著者:: Wybenga, George L.
出版事項: (2006)

Developing and Promoting an Ecotourism Package Tour in the Mekong Delta at Vntour Joint Stock Travel Company
著者:: Tran, Thuy Tien
出版事項: (2025)

Developing and Promoting a Leisure Package tour in Ninh Thuan - Binh Thuan at Sun Travel Co.ltd
著者:: Le, Huynh Ngoc Huyen
出版事項: (2025)

Food packaging :
著者:: Robertson, Gordon L.
出版事項: (2006)

Springer Handbook of Electronic and Photonic Materials. 2nd ed. 2017
著者:: Kasap, Safa, 等
出版事項: (2020)